H5TC4G63CFR-PBA

The SK Hynix H5TC4G63CFR-PBA is a specialized integrated circuit designed for memory applications, specifically a DRAM (Dynamic Random Access Memory) component packaged in a BGA (Ball Grid Array) format. This high-density memory solution is engineered to meet demanding performance requirements in compact electronic devices, offering robust data storage and rapid access capabilities. The component is manufactured by SK Hynix, a leading global semiconductor manufacturer known for producing high-quality memory solutions. Its BGA encapsulation provides enhanced electrical performance and mechanical stability, making it ideal for sophisticated electronic systems that require compact, reliable memory modules. While the specific technical parameters are not fully detailed in the provided specifications, BGA DRAM chips like this are typically used in a wide range of applications including mobile devices, embedded systems, telecommunications equipment, industrial computing, and automotive electronics. The large quantity (1000 units) suggests this is likely a bulk procurement for manufacturing or large-scale electronic product development. The BGA packaging ensures superior thermal management, signal integrity, and space efficiency compared to traditional memory packaging methods. This makes the H5TC4G63CFR-PBA particularly suitable for devices with limited physical space and high performance demands. Equivalent or alternative models might include similar BGA DRAM chips from manufacturers like Micron, Samsung, or other SK Hynix product lines with comparable specifications. However, for precise compatibility and direct replacements, detailed electrical and physical specifications would need to be carefully compared. The chip represents a critical component in modern electronic design, providing essential memory functionality in a compact, reliable, and high-performance format.