
The H26M52208FPR is an Managed Flash memory manufactured by SK Hynix supporting Managed Flash Revision 5.1 Standard. It has a total memory capacity of 16GB and comes in a 153 ball BGA package. It is build of MLC technology NAND Flash (2 dies of 64Gbit inside) and is made for an operating temperature of -25 to 85°C TA
SK Hynix H26M52208FPR technical specifications.
| Max Operating Temperature | 85 |
| Number of Terminals | 153 |
| Min Operating Temperature | -25 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | R-PBGA-B153 |
| Width | 11.5 |
| Length | 13 |
| Number of Functions | 1 |
| Temperature Grade | OTHER |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 2.7 |
| Number of Words | 17179869184 |
| Number of Words Code | 16000000000 |
| Memory IC Type | FLASH |
| Parallel/Serial | PARALLEL |
| Capacity | 16GB |
| Flash Type | MLC |
| Version | eMMC 5.1 |
| Automotive | No |
| RoHS | Yes |
| REACH | Compliant |
| Military Spec | False |
| Htm Code | 85423269 |
| Eccn Code | EAR99 |
Download the complete datasheet for SK Hynix H26M52208FPR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.