Quick Jump:
Technical Specifications
Texas Instruments AM3352ZCED50 technical specifications.
General
| Package/Case | LFBGA |
| Contact Plating | Copper, Tin, Silver |
| Core Architecture | ARM |
| Data Bus Width | 32b |
| Frequency | 500MHz |
| Interface | I2C, SPI, CAN, UART, USB, Ethernet |
| Lead Free | Lead Free |
| Max Frequency | 500MHz |
| Max Operating Temperature | 90°C |
| Memory Size | 64KB |
| Memory Type | ROM, |
| Min Operating Temperature | -40°C |
| Operating Supply Voltage | 1.1V |
| Package Quantity | 1 |
| Packaging | Tray |
| Radiation Hardening | No |
| RAM Size | 64KB |
| RoHS Compliant | Yes |
| Series | Sitara ARM®, Cortex™A8 |
| Voltage | 1.15V |
Compliance
| RoHS | Compliant |
Datasheet
Texas Instruments AM3352ZCED50 Datasheet
Download the complete datasheet for Texas Instruments AM3352ZCED50 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
