Automotive-grade D-Type positive-edge triggered flip-flop IC, featuring two independent elements. This CMOS logic device utilizes a Thin Shrink Small Outline Package (TSSOP W) with 14 gull-wing leads for surface mounting. The compact plastic package measures 5.1mm x 4.5mm x 1.05mm with a 0.65mm pin pitch, adhering to JEDEC MO-153AB-1 standards. Operating across a temperature range of -40°C to 85°C, it offers inverting/non-inverting polarity for versatile circuit design.
PackageTSSOP W
MountingSurface Mount
PolarityInverting/Non-Inverting
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Technical Specifications
Onsemi MC74AC74DT technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP W |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 14 |
| PCB | 14 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AB-1 |
| Logic Family | AC |
| Logic Function | D-Type |
| Process Technology | CMOS |
| Number of Elements per Chip | 2 |
| Number of Element Inputs | 1 |
| Number of Element Outputs | 1 |
| Polarity | Inverting/Non-Inverting |
| Triggering Type | Positive-Edge |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 5V1P1 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Onsemi MC74AC74DT Datasheet
Download the complete datasheet for Onsemi MC74AC74DT to view detailed technical specifications.
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