| Typ | Manufacturer |
|---|---|
| Webseite | https://www.wlcsp.com/EN/index.html |
| Telefonnummer | +86(0)512 67730001 |
| Adresse | No.29 Tinglan Lane, Suzhou Industrial Park, SuZhou 215026, China |
China Wafer Level CSP Co., Ltd. (SSE: 603005) was founded in Suzhou in 2005 with a vision on developing innovative technologies and assisting its customers in implementing high-volume manufacturing of reliable, miniaturized, high-performance and cost-effective semiconductor packages. China Wafer Level CSP's CMOS Image Sensor Chip-Scale Package technology revolutionized the packaging world, helping make the high-performance, miniaturized mobile camera modules of today possible.